Coercive E-government Policy Imposing Harm: The Need for a Responsible E-government Ethics

Jesper Bull Berger

Publikation: Bidrag til bog/antologi/rapportKonferencebidrag i proceedingsForskningpeer review

Abstract

Governments around the world are implementing e-government to achieve the widely anticipated positive outcomes - especially increased public sector efficiency. However, both public sector and citizen adoption of e-government lacks behind expectations and documented benefits from e-government investments are sparse. This may result in governments forcing citizens to e-government use, thus enforcing benefits realization. This paper reports from a case study of coercive e-government. The enactment of coercive digital communication between public sector and citizens in Denmark were explored through qualitative and quantitative empirical studies over three years. This case reveals that the coercive strategy imposed harm on individual, organizational and at societal levels. A responsible e-government ethics is derived from the empirical findings as a step to mitigate unintended harm from coercive e-government.
OriginalsprogEngelsk
Titel49th Hawaii International Conference on System Sciences, HICSS 2016, Koloa, HI, USA, January 5-8, 2016
RedaktørerTung X. Bui, Ralph H. Sprague Jr.
Antal sider10
ForlagIEEE
Publikationsdato2016
Sider2830-2839
ISBN (Trykt)9780769556703
StatusUdgivet - 2016
Udgivet eksterntJa
Begivenhed49th Annual Hawaii International Conference on System Sciences: Network Analysis of Social and Digital Media - Grand Hyatt, Kauai, USA
Varighed: 5 jan. 20168 jan. 2016
Konferencens nummer: 49
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Konference

Konference49th Annual Hawaii International Conference on System Sciences
Nummer49
LokationGrand Hyatt
LandUSA
ByKauai
Periode05/01/201608/01/2016
Internetadresse

Citer dette

Berger, J. B. (2016). Coercive E-government Policy Imposing Harm: The Need for a Responsible E-government Ethics. I T. X. Bui, & R. H. Sprague Jr. (red.), 49th Hawaii International Conference on System Sciences, HICSS 2016, Koloa, HI, USA, January 5-8, 2016 (s. 2830-2839). IEEE.